Date de publication :
01 avril 2025Taux d'activité :
100%- Lieu de travail :Lenzburg, Aargau, Switzerland
The opportunity
In our Semiconductors business unit in Lenzburg, we develop and produce high-performance state of the art semiconductors power module for applications in different fields like rail transportation, power transmission, renewable energy, eMobility and more.
How you’ll make an impact
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Develop new packaging technologies for power electronics (PE) modules to enable higher current capability, sustain higher temperatures and stresses under harsh environmental conditions
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Support the build-up and characterization of prototypes of IGBT modules for quality assessment using several techniques such as scanning acoustic microscopy, cross-sections, electrical and reliability testing
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Conduct design of experiments (DoEs) to support technology development through process and materials optimization
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Interact and collaborate with a dynamic and multidisciplinary team that will supervise and guide the project
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Use your strong technical background, motivation to develop innovative solutions, and goal-oriented approach to make a significant impact on the project
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Contribute in building a stronger and more sustainable energy future
The duration of the internship is 6 months.
Your background
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Currently pursuing a degree in material sciences, mechanical engineering, chemistry, physics, or similar discipline (B.Sc. or M.Sc. degree internship and/or thesis)
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Experience in laboratory work and know-how in sample preparation and material characterization techniques
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Know-how in data analysis tools and statistics is advantageous
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Strong problem-solving skills, with the ability to think creatively and independently to resolve technical challenges
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Excellent communication skills, both written and verbal, to effectively document the design and present results to the team
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Fluent in English, German is a plus
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A self-starter with a strong work ethic and the ability to work independently or as part of a team
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Willingness to learn new concepts and technologies related to semiconductor packaging
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Availability 5 – 10 months